Agentic capabilities are believed to become a baseline feature of all Artificial Intelligence capability layers, leading to a paradigm shift in technology as well as business models towards commercially exploitable technology components and value-added services. With IWOs together with heterogeneous advanced semiconductor devices forming the capability backbone of 6G intelligent wireless systems, an unprecedented magnitude of intelligent wireless services can be enabled. Although next generation intelligent wireless systems, such as 6G, are integrated naturally into the previous generation system hierarchies and service domains, it is expected that 6G and beyond will bring an unprecedented abundance of intelligent mobility supporting diverse human and machine work. In this chapter, we provide an outlook on advanced semiconductor capabilities tailored to face the ensuing challenge for revolutionizing intelligent wireless systems in 6G.

Semiconductor technologies have been the hidden backbone for large-scale capacity growth in intelligent wireless systems and the development of the wireless services ecosystem. Agentic Artificial Intelligence capabilities, integrated at various capability layers ranging from low-level AI microcontrollers powering intelligent wireless objects to high-level AI engines optimizing the end-to-end system, will credibly unveil the long awaited vision of Asynchronous and Volumetric Mobility. 6G is expected to bring an unprecedented abundance of intelligent mobility services, spanning diverse user categories. To accelerate the capabilities expansion of devices and the democratization of intelligent services, 6G intelligent wireless systems must exploit every area of the performance landscape, enabled by advanced semiconductor technologies that are combined and packaged intelligently